Fabrication des composants opto
Didier Chambonnet Villetaneuse, 2013 dchambonnet@3spgroup.com
Plan
Organisation d'une fab Ateliers
• • • • • • • • •
Epitaxie Process Plaques (couches minces, gravure, photomasquage etc…) Process barrettes (décope, couches optiques, passivation) Process puces In situ Ex situ Laser FP ILM Photodétecteur PIN
Caractérisations
Exemples de fabrications de composants
©2007 – 2010 3S PHOTONICS S.A. - All rights reserved - CONFIDENTIALITY NOTICE: The information contained in this presentation is 3S PHOTONICS confidential information. Any dissemination, distribution or copying of this presentation or disclosure of the information contained within by any unauthorized person is strictly prohibited.
Organisation type d'une fab de semiconducteurs
Direction des opérations
LOGISTIQUE / PLANIFIFICATION
SUPPORT
FABRICATION Process Epitaxie Process plaques Process barrettes Process puces Assemblage modules
SECURITE & MAINTENANCE Sécurité & Environnement Maintenance Usine Maintenance Equipements
QUALITE FIABILITE
Support Produits Support Process
Front-End Back-End
Test modules Fabrication FBG
©2007 – 2010 3S PHOTONICS S.A. - All rights reserved - CONFIDENTIALITY NOTICE: The information contained in this presentation is 3S PHOTONICS confidential information. Any dissemination, distribution or copying of this presentation or disclosure of the information contained within by any unauthorized person is strictly prohibited.
Processus de fabrication
De la plaque InP ou AsGa au module
Epitaxie
Couche contact Confinement P QW Confinement N Substrat
Process plaques
Photolithographie Gravure Couches minces Métallisation
Process Barrettes
Découpe plaque
Process puces
Anti-reflet Miroir HR
Découpe barrettes Lasers InP
Report puce sur embase (CoC) Cablage
Dépose + découpe puce
Lasers AsGa Couches optiques Montage barrettes Passivation UHV